Expanded Product List
Master Bond Product Search
183 products match
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EP30AOHT Thermal conductive/electrically insulative epoxy for bonding, potting, sealing, coating. Serviceable from -60°F to +400°F. Low CTE. Rigid bonds. Excellent dielectric strength. Flowable. |
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EP30AOSP Room temperature curing epoxy. Thermally conductive/electrical insulative. Low viscosity with excellent flowability. Suitable for potting and casting. Outstanding chemical resistance. Shore D hardness 90. High compressive strength. Serviceable from -60°F to +250°F. |
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EP30C Two component nickel filled electrically conductive epoxy system. High strength. Resists chemical exposure and thermal cycling. Good heat dissipation. Superior EMI/RFI shielding properties. 100% reactive. Serviceable from -60°F to +250°F. |
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EP30FLAO Flexibilized, thermally conductive, electrically insulative potting compound. Excellent flowability. Low thermal expansion coefficient. Superior dimensional stability. Serviceable from 4k to +250°F. Resists water, oils, many solvents. Good physical strength properties. |
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EP30LTE Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates. |
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EP30LTE-2 Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates. |
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EP30LTE-LO Black Two component epoxy system. Low thermal expansion coefficient and dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30LTE-LO Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30NG Graphene filled epoxy. Non-drip system for bonding and sealing. Cures at room temperature. Superior abrasion resistance. |
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EP30TC Thermally conductive epoxy. Can be applied in sections as thin as 5-10 microns. Excellent flow properties. Service temperature range -100°F to +300°F. High compressive strength. Outstanding electrical insulation characteristics. Passes NASA low outgassing tests. Low CTE. |