Expanded Product List
Master Bond Product Search
183 products match
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EP112AO Low viscosity potting, casting, encapsulation compound. Two component, solvent free, heat cure epoxy. Moderate viscosity. Good water and chemical resistance. Excellent thermal conductivity and electrical insulation properties. Long working life. Viscosity 50-200 cps. Service temperature range from -60°F to 500°F. |
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EP112FLAN-1 Two component epoxy formulation well suited for potting and encapsulation. Exceptionally high thermal conductivity. High dielectric strength. Good toughness. Service temperature range from -60°F to 500°F. Dimensional stability. Advantageous flow properties. |
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EP112FLAO-1 Toughened two component epoxy resin system. High thermal conductivity and electrical insulation characteristics. Outstanding dimensional stability. Low coefficient of expansion. Meets NASA low outgassing requirements. Operating service temperature range from -60 to +450°F. |
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EP121AO Thermally conductive, electrically insulative. Long working life. Outstanding dimensional stability. Superb heat resistance. Low coefficient of thermal expansion. Passes NASA low outgassing tests. Very long open time. Ideally suited for potting applications. Serviceable from -60°F to +500°F. Medium viscosity. |
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EP17HT-100 High performance one part epoxy. Good flow properties. Thermally conductive, electrically insulative. Service temperature range -100°F to +500°F. Can be cast in thicknesses up to 1/2 inch. High dimensional stability. |
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EP17HTDA-1 Single component heat curable epoxy adhesive/sealant. Non-drip system. Resists up to 525°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure. |
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EP17HTDA-2 One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-5 hours at 300°F or 3-4 hours at 350°F. Post cure to optimize properties. High glass transition temperature. NASA low outgassing approved. |
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EP17HTDM-2 Black One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-6 hours at 300°F or 2-3 hours at 350°F. Post curing at 400°F for 1-2 hours to optimize properties. Limited flow and low exotherm when curing. |
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EP17HTND-CCM Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 550°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 160-165°C after post cure. |
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EP17HTS-DA Silver filled, one part, no mix, die attach epoxy with electrical conductivity and high temperature resistance. It is a silver filled system. This specialty formulation maintains a high Tg of 140-150°C and passes MIL-STD-883J thermal stability requirements at 200°C. |