Expanded Product List
Master Bond Product Search
183 products match
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EP29LPAO Thermally conductive/electrically insulative epoxy for large potting/encapsulation applications. Low exotherm. Long working life. Excellent flow properties. Very low shrinkage upon cure. Impressive compressive strength. Shore D hardness 80-90. Serviceable from -60°F to +250°F. |
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EP29LPAOHT Two component epoxy system featuring good thermal conductivity along with being electrically isolating. It is a low to moderate viscosity system with excellent flow properties. It can be mixed in masses over a gallon because it generates an exceptionally low exotherm. High modulus, outstanding compressive strength, and a low coefficient of thermal expansion. The service temperature range is -60°F to +350°F. |
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EP29LPSPAO Low exotherm potting/encapsulation compound. Heat curing two component thermal conductive/electrical insulative system. Can withstand cryogenic shocks. Superior electrical insulation properties. Good chemical resistance. High dimensional stability. Vacuum compatible. Service operating temperature range from 4K to +275°F. |
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EP29LPSPAO-1 BLACK Thermally conductive/electrically insulative epoxy for bonding, sealing, potting. Good flow properties. Serviceable from 4K to +250°F. Can withstand cryogenic shocks. High dimensional stability. Complies with NASA low outgassing specifications. Black color. |
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EP29LPTCHT Two component epoxy featuring a low viscosity with excellent flow properties. It is electrically insulative and thermally conductive with an impressive fine particle size filler material. Bond line thicknesses range from 5 to 15 microns. |
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EP30AN Epoxy features superior heat transfer properties. High impact strength. Abrasion resistant. Low CTE. Excellent flowability. Ideal for potting and encapsulation. Serviceable from -60°F to +250°F. |
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EP30AN-1 Thermal conductive/electrically insulative epoxy cures at room temperature. Outstanding heat dissipative properties. Serviceable from -60°F to +250°F. Low viscosity. Suitable for potting/encapsulation. NASA approved for low outgassing. |
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EP30AN-1LP Exceptionally high thermal conductivity. Superb electrical insulation properties. Versatile cure schedule. Excellent flowability. Long working life. Rigid bonds. Impressive compressive strength. Serviceable from -60°F to +250°F. |
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EP30ANHT Epoxy bonding, sealing, coating compound. Outstanding thermal conductivity and electrical insulative properties. Low CTE. Good flowability. Ideal for potting/encapsulation. Serviceable from -60°F to +450°F. |
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EP30AO Low viscosity, thermally conductive potting, bonding and sealing compound. Cures at room temperature. Superior electrical insulation properties. High compressive strength. Rigid bonds. Low thermal expansion coefficient. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. |