Expanded Product List
Master Bond Product Search
183 products match
 |
EP21TDCN-LO Two component nickel conductive epoxy featuring high peel strength, superior toughness and low volume resistivity. Withstands thermal cycling. Meets NASA low outgassing specifications. The service temperature range is -100°F to +275°F. |
 |
EP21TDCNFL Two component nickel conductive epoxy adhesive. High flexibility. Excellent peel strength. Service temperature range from 4K to +250°F. Low shrinkage upon cure. Resists a wide range of chemicals. Volume resistivity 5-10 ohm-cm. Convenient one to one mix ratio by weight or volume. |
 |
EP21TDCS Two component, silver filled electrically conductive epoxy system with a convenient one to one mix ratio and very low volume resistivity. Cures at room temperature. Superior toughness. Serviceable from 4K to +275°F. Withstands rigorous thermal cycling. Successfully tested for 1,000 hours 85°C/85% RH. Exhibits superb thermal conductivity. |
 |
EP21TDCS-LO Silver conductive, room temperature curing epoxy adhesive meets NASA low outgassing specifications. Serviceable from 4K to +275°F. High bond strength properties. Withstands thermal cycling. Outstanding toughness. Volume resistivit <10-3 ohm-cm. Paste viscosity. Convenient one to one mix ratio by weight or volume. |
 |
EP21TDCSFL SIlver filled electrically conductive epoxy adhesive. Low volume resistivity. Highly flexible. Excellent peel and shear strength. Low linear shrinkage upon cure. Good flow properties. Cures at room temperature. Resists vibration, impact, thermal cycling. Serviceable from 4K to +250°F. |
 |
EP21TDCSMed Silver conductive epoxy with low volume resistivity and USP Class VI certification. Cures at room temperature or more quickly at elevated temperatures. Durable. Serviceable from 4k to +250°F. Smooth paste. One to one mix ratio by weight or volume. Shore D hardness 50-60. High bond strength. |
 |
EP21TPFL-1AO Two part, room temperature curing, very flexible polysulfide system with excellent thermal conductivity. Low viscosity and good flowability for potting and encapsulating applications. Superior electrical insulation characteristics. Withstands thermal cycling. Reliable resistance to fuels and oils. Long open time. Serviceable from -60°F to +250°F. |
 |
EP21TPHTAO Two component thermally conductive/electrically insulative polysulfide epoxy adhesive/sealant. Durable tough high strength bonds. Unsurpassed resistance to fuels and oils. Serviceable from -60°F to +325°F. |
 |
EP24AN Fast curing two component epoxy adhesive. Outstanding thermal conductivity and electrical insulation properties. Self leveling paste. Easy to apply. High bond strength. Long term durability. Low coefficient of expansion. Superb dimensional stability. Service operating temperature range from -60°F to +250°F. |
 |
EP24AO Thermally conductive/electrically insulative epoxy adhesive. Fast curing at ambient temperature. Non-critical equal weight or volume mix ratio. High bond strength. Dimensionally stable. Service operating temperature range from -60°F to +250°F. |