Thermally Conductive

B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation. Magnificent Structural Adhesive Properties and Exceptional Thermal Cycling Capabilities.

Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability Along With Exceptional Electrical Insulation Properties.

Two Component Nickel Conductive Epoxy System for Bonding, Sealing and Coating Featuring Fast Set Up and Cure Times.

Two Component, Low Viscosity Heat Curing Epoxy Resin System High PerformanceThermal Conductive & Electrical Insulation For Potting & Encapsulation Applications