Thermally Conductive

EP21TPHTAO Product Description

EP21TPHTAO Two Part Polysulfide/Epoxy

Two Component Thermally conductive Polysulfide/Epoxy Adhesive/Sealant For High Performance Bonding and Sealing

EP24AN Product Description

EP24AN Two Part Epoxy

Fast Curing, Two Component Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio, Exceptionally High Thermal Conductivity, and Excellent Electrical Insulation Properties.

EP24AO Product Description

EP24AO Two Part Epoxy

Thermally Conductive, Two Component Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio and Fast Cure

EP29LPSPAO Product Information

EP29LPSPAO Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulative, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock.

EP29LPSPAO-1 Black Product Information

EP29LPSPAO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

EP30AN Product Information

EP30AN Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.

EP30AN-1 Product Information

EP30AN-1 Two Part Epoxy

Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications

EP30ANHT Product Description

EP30ANHT Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.

EP30AO Product Information

EP30AO Two Part Epoxy Resin System

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.

EP30AOHT Product Description

EP30AOHT Two Part Epoxy

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Bonding, Potting, Sealing & Coating. Offers High Temperature Resistance & Excellent Thermal Properties along with Good Flow.

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