One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Thermally Conductive, Low Temperature Heat Curing Epoxy Adhesive Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance.
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
