Thermal Cycling Resistant

EP3SP5FL-ND2 Product Information

One component “snap cure” epoxy adhesive

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EP3RR-80 Product Information

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

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EP21HT-LO Product Information

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

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EP46CA-1 Product Information

Two component epoxy for structural bonding featuring superlative heat resistance; requires oven curing.

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Supreme 45HTND-2 Product Information

Two Component, High Temperature Resistant Epoxy System for High Performance Bonding, Sealing and Coating Featuring Superior Thermal Cycling Capabilities.

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EP41S-LO Product Information

Two Component Epoxy Resin System for Durable, High Performance,
High Strength Coatings, Liners and Sealants Featuring Chemical Resistance and Fast Cure.

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EP21TDC-2LOND Product Information

Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.