One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.
Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.
Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity. Meets NASA Low Outgassing Specifications.
