Two Component, Heat Resistant Epoxy Adhesive for High Performance General Purpose Bonding, Outstanding High Thermal Conductivity, Excellent Dimensional Stability Up to 250°F Service Featuring Both High Shear and High Peel Strength
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
Two Component Toughened Heat Resistant Epoxy Adhesive for High Performance Structural Bonding, Sealing and Coating. Featuring Serviceability up to 500°F. Superior Thermal Cycling Capabilities.
