Non-Drip

X5G Product Information

X5G One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5N Product Information

X-5N One Part Elastomeric Compound

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5SC Product Information

X5SC One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

Supreme 45HTQ-4 Product Information

Supreme 45HTQ Two Component Epoxy

Two component epoxy system for bonding, sealing and casting

EP21NDCL Product Information

EP21NDCL Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

EP31ND Product Information

EP31ND Two Part Epoxy Adhesive

Two Component, Room Temperature Curing Epoxy Adhesive for Structural Bonding Featuring Extraordinarily High Shear & Peel Strengths

Supreme 3HTND-2CCM Product Information

Supreme 3HTND-2CCM One Part Epoxy

One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.

MasterSil 973S-LO Product Information

MasterSil 973S-LO Two Part Silicone Compound

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

MasterSil 930 Product Information

MasterSil 930 One Part Fluorosilicone System

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

EP21HTND Product Information

EP21HTND Two Component Epoxy Adhesive

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

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