One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.
One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications
Two Component, Silver Coated Nickel Filled Epoxy for High Performance Bonding, Coating and Sealing Featuring Low Volume Resistivity, High Flexibility, Convenient Handling and Cost Effectiveness.
Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration
Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.
One Component, High Strength Flexible UV Curable Epoxy Resin Compound For High Performance Bonding, Coating and Sealing With Enhanced Thermal Stability and Exceptional low shrinkage upon Curing.
