EP21TDCNFL Product Information

Two Component Nickel Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Good Electrical Conductivity and High Flexibility.

EP21TDCSFL Product Information

EP21TDCSFL Two Part Conductive Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.

EP21TPFL-1 Product Information

EP21TPFL-1 Two Component Epoxy Polysulfide

Two Component, Low Viscosity Epoxy Polysulfide Compound for High Performance Bonding, Sealing, Coating and Casting with Outstanding Resistance to Fuels, Oils and Other Chemicals; Offers Exceptionally High Flexibility.

EP21TPFL-1AO Product Information

EP21TPFL-1AO Two Part Epoxy Polysuifide System

Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System for High Performance Bonding, Sealing, Coating and Casting; Outstanding Resistance to Fuels and Oils with Superior Thermal Conductivity and Electrical Insulation Properties.

EP30FL Product Information

EP30FL Two Part Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.

EP30FLAO Product Description

EP30FLAO Two Part Epoxy Compound

Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.

EP30FLSP Product Description

EP30FLSP Two Component Epoxy

Low Viscosity, Flexibilized, Two Component Epoxy Compound for High Performance Potting, Casting, Encapsulation, Bonding and Sealing. Contains UV Blocking Agent & Wetting Agent

EP37-3FLF Product Information

EP37-3FLF Two Component Epoxy System

Two component, room temperature curing epoxy for bonding, casting and coating

EP37-3FLFAN Product Information

EP37-3FLFAN Two Part Epoxy System

Two Component, Room Temperature Curing, Highly Thermally Conductive, Electrically Isolating Epoxy For Potting, Bonding, Sealing & Coating Featuring Flexibility and Low Viscosity.

EP39MHT Product Information

EP39MHT Two Part Epoxy System

Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F

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