­
EP4NS-80 Product Description | MasterBond.com

One component, optically clear nanosilica filled epoxy for bonding and sealing with curing temperature of 80°C to 85°C. Meets NASA low outgassing.

One Part Epoxy System EP4NS-80

Key Features

  • Low viscosity
  • Not premixed and frozen
  • High glass transition temperature
  • Can be used for underfill and impregnation
Back to Top