UV15DC80-1Med Product Information

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV23FLDC-80TK Product Information

One Part, Dual Curing Adhesive UV23FLDC-80TK

One component, moderate viscosity, dual curing, cationic type system. Good flexibility. Serviceable from -80°F to 300°F.

UV15DC80LV-FHC Product Information

UV15DC80LV-FHC One Part Dual Curing Adhesive

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80-1 Product Information

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80-10FHC Product Information

UV15DC80-10FHC Dual Cure Epoxy

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80-FHC Product Information

UV15DC80-FHC

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80-10 Product Information

One Part UV and Heat Curable Compound

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80TK Product Information

UV15DC80TK One Part UV and Heat Curable Epoxy

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV22DC80ND Product Information

Nanosilica Filled, UV Dual Cure System

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.

UV22DC80TK Product Information

UV22DC80TK One Part, Dual UV and Heat Curing System

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.

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