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The following is a news release from Master Bond Inc.  You have received it because you are listed as an editor for your publication.  

Attached to this email is a low resolution version of the photograph that is included in the press kit for this product.

High resolution versions of this image and files with the body text of this release are available at http://www.masterbond.com/mbnr.html?nr=ep21tcht-1.

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FOR IMMEDIATE RELEASE


Rigid, Room Temperature Curing Thermal 
Conductive Epoxy For Service Up To 400°F

HACKENSACK, NJ – May 7, 2009 – In many challenging bonding applications, elevated temperature cures are not possible.  In order to overcome this deficiency, Master Bond has made available new EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F.  It also has a remarkably low thermal expansion coefficient.  EP21TCHT-1 is NASA qualified for low outgassing applications.  It is highly recommended for use in vacuum environments.

Master Bond EP21TCHT-1 is durable and possesses high physical strength properties.  Adhesion to metals, ceramics, woods, vulcanized rubbers and most plastics is excellent.  Bonds are resistant to water, fuels and most organic solvents.  EP21TCHT-1 has a mix ratio of 100 to 60 by weight.  It has a light paste viscosity and is easy to apply.




CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ  07601-3922
Web: www.masterbond.com

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