Expanded Product List
Master Bond Product Search
47 products match
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EP17HTS-DA Silver filled, one part, no mix, die attach epoxy with electrical conductivity and high temperature resistance. It is a silver filled system. This specialty formulation maintains a high Tg of 140-150°C and passes MIL-STD-883J thermal stability requirements at 200°C. |
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EP21TDCN Nickel conductive epoxy adhesive. Volume resistivity is 5-10 ohm-cm. 100% reactive. Superior toughness. One to one mix ratio by weight or volume. Smooth paste viscosity. Ambient temperature cures or fast elevated temperature cures. Service operating temperature range from -100°F to +275°F. High bond strength. |
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EP21TDCN-LO Two component nickel conductive epoxy featuring high peel strength, superior toughness and low volume resistivity. Withstands thermal cycling. Meets NASA low outgassing specifications. The service temperature range is -100°F to +275°F. |
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EP21TDCNFL Two component nickel conductive epoxy adhesive. High flexibility. Excellent peel strength. Service temperature range from 4K to +250°F. Low shrinkage upon cure. Resists a wide range of chemicals. Volume resistivity 5-10 ohm-cm. Convenient one to one mix ratio by weight or volume. |
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EP21TDCS Two component, silver filled electrically conductive epoxy system with a convenient one to one mix ratio and very low volume resistivity. Cures at room temperature. Superior toughness. Serviceable from 4K to +275°F. Withstands rigorous thermal cycling. Successfully tested for 1,000 hours 85°C/85% RH. Exhibits superb thermal conductivity. |
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EP21TDCS-LO Silver conductive, room temperature curing epoxy adhesive meets NASA low outgassing specifications. Serviceable from 4K to +275°F. High bond strength properties. Withstands thermal cycling. Outstanding toughness. Volume resistivit <10-3 ohm-cm. Paste viscosity. Convenient one to one mix ratio by weight or volume. |
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EP21TDCSFL SIlver filled electrically conductive epoxy adhesive. Low volume resistivity. Highly flexible. Excellent peel and shear strength. Low linear shrinkage upon cure. Good flow properties. Cures at room temperature. Resists vibration, impact, thermal cycling. Serviceable from 4K to +250°F. |
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EP21TDCSMed Silver conductive epoxy with low volume resistivity and USP Class VI certification. Cures at room temperature or more quickly at elevated temperatures. Durable. Serviceable from 4k to +250°F. Smooth paste. One to one mix ratio by weight or volume. Shore D hardness 50-60. High bond strength. |
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EP30C Two component nickel filled electrically conductive epoxy system. High strength. Resists chemical exposure and thermal cycling. Good heat dissipation. Superior EMI/RFI shielding properties. 100% reactive. Serviceable from -60°F to +250°F. |
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EP3HTN Nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |