Expanded Product List
Master Bond Product Search
552 products match
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EP21SL5 Epoxy adhesive for bonding teak wood and other types of wood. Inique capability of adhering well to oily surfaces. Inert to water and many chemicals. Service temperature range -60°F to 275°F. 100% reactive. High strength. Long term durability. |
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EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
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EP21TDC Superior toughness. Ideal for bonding similar and dissimilar substrates. Withstands aggressive thermal cycling. Convenient one to one mix ratio. Good flow properties. User friendly. Versatile cure schedule. Serviceable from -60°F to +250°F. |
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EP21TDC-2 Highly flexibilized. Serviceable from 4K to +250°F. Excellent peel strength. Superb thermal and electrical insulator. Good flow. Easy to apply. Low exotherm. Cures at ambient temperature. Variable hardness depending on cure schedule. |
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EP21TDC-2AN Flexibilized. Thermally conductive/electrically insulative. Thermal conductivity 22-24 BTU· in/ft2 hr· ° F. Serviceable from 4K to +250°F. Superb impact resistance. Long working life. High peel strength. Elongatio >25%. |
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EP21TDC-2AO Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Bonds well to similar and dissimilar substrates. Serviceable from 4k to +250°F. |
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EP21TDC-2AOLV Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Low viscosity formulation bonds well to similar and dissimilar substrates. Serviceable from 4K to +250°F. |
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EP21TDC-2LO Highly flexibilized, thermally conductive/electrically insulative epoxy adhesive. High elongation. Exhibits superior shear and peel strength properties. Serviceable from 4K to 250°F. Withstands thermal cycling, thermal shock and mechanical shock. Passes NASA low outgassing test. Cures at room temperature or more quickly at elevated temperatures. |
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EP21TDC-2LOND Highly flexible epoxy paste adhesive. Outstanding peel strength. Elongatio >25%. Thermally conductive/electrically insulative. Low outgassing. |
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EP21TDC-2ND Two part highly flexible epoxy resin system. Smooth paste viscosity. Fills gaps. Excellent peel strength. Dependable resistance to thermal cycling. |