Expanded Product List
Master Bond Product Search
552 products match
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EP21FRNS-2 Durable potting, encapsulation, casting compound meets UV 94V-0 flame retardant specifications. Convenient one to one mix ratio by weight. Features a non-halogen filler. Superb flow properties. Outstanding electrical insulation. Low smoke generation. Serviceable from -51°C to +90°C. |
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EP21H Two component optically clear epoxy system. Special cross linking profile that allows for exceptional light transmission in the 250-365 nm spectra Long pot life. Low viscosity. Excellent physical strength properties. Serviceable from -60°F to +250°F. |
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EP21HT Two component adhesive, sealant and coating. High mechanical strength properties. Volume resistivity of 1014 ohm-cm. Dielectric constant of 2.90. One to one mix ratio. Tensile lap shear when bonding aluminum to aluminum of 3,200 psi at 75°F. Superior chemical resistance. Serviceable from -60°F to +400°F. Cures readily at ambient temperature or faster at elevated temperatures. Meets FDA 175.105 requirements for indirect food applications. |
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EP21HT-LO NASA low outgassing approved. Two component smooth flowing epoxy with convenient one to one mix ratio weight or volume. High bond strength. Excellent electrical insulation properties. Withstands 1,000 hours 85°C/85% RH. |
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EP21HTFG Two component room temperature curing epoxy adhesive, sealant, coating. Moderate viscosity. Forgiving one to one mix ratio weight or volume. Formidable bond strength. Can be used for indirect food contact applications as per FDA 175.105 specifications. Serviceable from -60°F to +400°F. |
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EP21HTND Room temperature curing two component non-drip paste adhesive. Serviceable from -60°F to +400°F. Impressive bond strength. Gap filler. Forgiving one to one mix ratio. Meets FDA Section 175.105 for indirect food contact. Shore D hardnes >75. |
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EP21HV High performance two component adhesive, sealant, encapsulant. Good flow characteristics. Minimal shrinkage upon cure. Superior bond strength to similar and dissimilar substrates. One to one mix ratio weight or volume. Serviceable from -60°F to +250°F. |
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EP21LP Black Moderate viscosity. Allows the hardness to be altered by adjusting the mix ratio. Reliable electrical insulator. Dimensionally stable. High physical strength. Low shrinkage upon curing Serviceable from -60°F to +250°F. Black color. |
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EP21LP Gray Room temperature curing two component epoxy adhesive, sealant, coating, encapsulant. Varying mix ratio can adjust hardness of cure. Superior electrical insulation properties. Superb dimensional stability. Chemical resistant. Serviceable from -60°F to +250°F. Gray color. |
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EP21LP Two component clear epoxy system. One to one mix ratio by weight or volume. Flowable. High bond strength. Temperature range from -60°F to +250°F. Versatile cure schedule. Easy application. |