Expanded Product List
Master Bond Product Search
69 products match
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EP79FL Highly flexible, silver coated/nickel filled epoxy system. T-peel greater than 20 pli. Low volume resistivity. High bond strength to similar and dissimilar substrates. Resists exposure to thermal cycling. Serviceable from 4k to +275°F. One to one mix ratio by weight. Ambient temperature curing. 100% reactive. Withstands moisture, chemical exposure. Available in premixed and frozen syringes. |
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EP88FL Low viscosity, optically clear adhesive. Resistant to thermal cycling and thermal shock. Highly desirable Shore D hardness range. Bonds well to dissimilar substrates. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume. |
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Supreme 10ANHT Thermally conductive version of our one part Supreme 10HT epoxy system with excellent heat transfer properties. Outstanding bond strength. Thermal conductivity 20-25 BTU ·in/ft2 ·hr/°F. Serviceable from 4k to +400°F. Superior durability. Versatile cure schedule at elevated temperatures. Can withstand prolonged exposure to water, fuels, oil, organic solvents. Gray color. |
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Supreme 10ANHT-LO NASA low outgassing approved one component thermally conductive epoxy adhesive. Cryogenically serviceable. Smooth paste consistency. Low coefficient of thermal expansion. Effective shear and peel strength. Stellar electrical insulation properties. Serviceable from 4K to +400°F. |
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Supreme 10AOHT One part, oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. Serviceable from 4k to +400°F. Convenient processing. |
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Supreme 10AOHT-LO Thermally conductive and electrically insulative, one part epoxy adhesive. Superior toughness and dimensional stability. Bonds are resistant to thermal cycling and many chemicals. Serviceable from 4K to +400°F. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. Impressive physical strength properties. |
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Supreme 10HT One part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. Requires oven curing at 250-300°F. NASA low outgassing approved. Serviceable from 4k to +400°F. Tough and durable. 85°C/85% RH resistance. |
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Supreme 10HTCL Single component toughened epoxy adhesive with good flow properties. Resistant to thermal cycling, mechanical vibration/shock. Tensile lap shear strength 2,800-3,000 psi. T-peel strength 25-30 pli. Cures in 60-75 minutes at 250°F, shorter times at higher temperatures. Successfully tested at 1,000 hours 85°C/85% RH. Serviceable from 4k to +400°F. |
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Supreme 10HTF-1 Fast curing one component thixotropic paste epoxy. Excellent bond strength. Superb toughness and durability. Viscosity remains constant with time. Solid chemical resistance. Reliable electrical insulator. Serviceable from 4k to +400°F. |
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Supreme 10HTFL Highly flexible, no mix adhesive. Offers outstanding peel strength. 100% reactive. Superior water and chemical resistance. Successfully tested for 1,000 hours 85°C/85% RH. Withstands rigorous thermal cycling. Serviceable from 4k to +350°F. |