Expanded Product List
Master Bond Product Search
619 products match
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Supreme 10HTFL Highly flexible, no mix adhesive. Offers outstanding peel strength. 100% reactive. Superior water and chemical resistance. Successfully tested for 1,000 hours 85°C/85% RH. Withstands rigorous thermal cycling. Serviceable from 4k to +350°F. |
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Supreme 10HTLV One part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. Requires oven curing at 250-300°F. NASA low outgassing approved. Serviceable from 4k to +400°F. Tough and durable. 85°C/85% RH resistance. |
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Supreme 10HTN-NV High peel and shear strength single component nickel filled epoxy adhesive. Thixotropic system. Cost effective electrical conductivity. Resists from 4k to +400°F. |
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Supreme 10HTS Silver filled system with excellent electrical conductivity and high physical strength properties. One part, heat cured (250-300°F) epoxy. Wide range of serviceability from cryogenic temperatures up to +400°F. Meets NASA low outgassing specifications. Can be applied without sagging or dripping, even on vertical surfaces. Volume resistivit <0.006 ohm-cm. Thermally conductive. Shore D hardnes >75. |
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Supreme 11 High shear/peel strength epoxy adhesive. Two component system offers one to one mix ratio by weight or volume. Temperature range from -100°F to +300°F. Resists impact, thermal shock and stress cracking fatigue. Excellent long-term durability. Easy application. |
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Supreme 112 Potting, encapsulation, coating, sealing, impregnation compound. Low viscosity, long working life. Superior physical strength. Serviceable from -80°F to 550°F. |
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Supreme 11AN Epoxy adhesive features outstanding thermal conductivity. Superb electrical insulation properties. Tough bonds. High shear and peel strength. Cures at ambient temperatures. Low CTE. Paste viscosity. Serviceable from -100°F to +250°F. |
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Supreme 11ANHT High temperature resistant epoxy for bonding and sealing. Toughened formulation. Superior shear/peel strength. Excellent heat transfer properties. Superb dielectric characteristics, Serviceable from -112°F to +400°F. |
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Supreme 11ANHT-2 High temperature resistant epoxy for bonding, coating and sealing. Toughened formulation. Withstands thermal cycling. Excellent heat transfer properties. Small particle size allows for thin bond lines and low thermal resistance. Serviceable from -112°F to +400°F. |
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Supreme 11AO Thermally conductive/electrically isolating epoxy adhesive/sealant. Ambient temperature curing. Convenient one to one mix ratio by weight or volume. Thick paste. High peel and shear strength. Toughened system. Well suited for bonding dissimilar substrates. Service temperature range -100°F to +250°F. |