Expanded Product List
Master Bond Product Search
619 products match
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MB318 One component ethyl cyanoacrylate. Viscosity 2,400 cps. Black color. Slower set times than typical cyanoacrylate adhesives. Serviceable from -65°F to +250°F. |
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MB350 Low viscosity alkoxyethyl cyanoacrylate. High strength, rapid curing. Low odor, low bloom system. No mixing or heating needed. Good resistance to cleaning agents. Serviceable from -60°F to +250°F. |
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MB525 Master Bond Polymer System, MB525, is a high performance epoxy hot melt compound designed to provide excellent adhesion to metals, glass, wood and other substrates. It exhibits a comparatively low softening point of 190-220°F, low viscosity at 300°F and low peel values. Bond strength develops rapidly and is maintained over a wide temperature range (-25°F to +130°F). |
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MB600 Environmentally safe, water soluble, one part system. Thermal stability up to +1,500°F. Outstanding strength, dimensional stability and electrical insulation properties. Completely odorless, non-toxic and non-flammable. Cures obtained at moderately elevated temperatures. |
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MB600G Graphite filled, aqueous based, sodium silicate based coating for EMI/RFI shielding and static dissipation. Cost effective. Easily applied by brush or spraying. Superb temperature resistance from 0°F to +700°F. |
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MB600S Aqueous based sodium silicate system. One component, silver filled formulation. Highly effective moisture barrier. Bonds well to a wide variety of substrates. Temperature resistance up to 700°F. Excellent shielding effectiveness. Simple, safe handling. |
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MB600SCN Electrically conductive sodium silicate, aqueous based coating. Silver coating nickel filled system. Impressive shielding effectiveness Room temperature or heat curable. Can be effectively brushed or sprayed on surfaces. Serviceable from 0°F to +700°F. |
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MB6A For deflashing and decapsulation of cured epoxy resin compounds. One part system is 100% biodegradable. Initiates and promots disintegration by flaking and breaking. |
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Steelmaster 43HT Stainless steel filled epoxy with rapid cure speed at room temperature. Exceptionally high compressive strength. 100% solid system. Readily machinable after cure. Rebuilds worn metal parts. Serviceable from -60°F to +400°F. |
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Super Gel 9 Two part, room temperature curing, epoxy gel compound for sealing and encapsulation. Optically clear, soft and dimensionally stable. Ideal for retrievability. Two to one mix ratio by weight or volume. Low exotherm. Long working life. Low viscosity system. Unsurpassed thermal cycling and mechanical shock resistance. Used in conjunction with sensitive electronic and optical components. Serviceable from -100°F to +200°F. |