Expanded Product List
Master Bond Product Search
552 products match
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
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Supreme 30 Low viscosity, toughened, two component epoxy adhesives. High strength system. Superior durable. Adheres well to similar/dissimilar substrates. Serviceable from -60°F to +250°F. Exceptionally low shrinkage upon cure. Ambient temperature curing formulation. |
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Supreme 30AOHT Toughened, two component, thermally conductive/electrically insulative epoxy system. Bonding, sealing, casting compound. Resists chemical exposure and thermal cycling. 100% reactive. Low exotherm. High T-peel strength. Ambient temperature curing. Service temperature range -60°F to +250°F. |
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Supreme 33 Thermally stable, toughened, two component epoxy adhesive, sealant, coating. Serviceable from -80°F to +425°F. Good strength retention at elevated temperatures. Superior durability. Withstands thermal cycling. Chemical resistant. Ambient temperature curing. One to one mix ratio by volume. |
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Supreme 33CLV Two component, room temperature curing structural epoxy system. Excellent bonding properties. Superior thermal cycling capabilities. Convenient one to one mix ratio by volume. Moderate viscosity. Toughened system. Outstanding resistance to water, fuels, various solvents acids and bases. Shore D hardness 75-80. |
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Supreme 33ND Toughened, two component, non-drip epoxy adhesive, sealant, coating. Gap filling. Temperature range from -80°F to +425°F. Thermal shock and chemical resistant. Excellent durability and dimensional stability. Minimal shrinkage upon curing. Solid electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 34AO Room temperature curing epoxy with high thermal stability. Serviceable from -60°F to +450°F. Thermal conductive/electrically insulative. Paste viscosity. Gap filling. Superior durability. Low CTE. High bond strength. Resists repeated thermal cycling. |
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Supreme 34CA Serviceable from -80°F to +500°F. Good flow properties. Two component epoxy system. Impressive resistance to aggressive chemicals. Oven curing. Structural adhesive. Superior electrical insulator. Used for filament winding, bonding composites, pultruded structures. |
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Supreme 3AN One part epoxy adhesive offers exceptional thermal conductivity. Good electrical insulating properties. Cures in 5-10 minutes at 300°F or 20-30 minutes at 250°F. Bonds withstand thermal cycling, vibration, stress fatigue cracking. Serviceable from -100°F to +250°F. |
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Supreme 3ANHT Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Thick paste viscosity. Shore D hardnes >75. Serviceable from -100°F to +350°F. |