Expanded Product List

Two component nickel filled electrically conductive epoxy adhesive. Volume resistivity of 5-10 ohm-cm. Serviceable from -60°F to +400°F. Forgiving one to one mix ratio by weight or volume. High bond strength. Thermal conductivity. Paste like consistency. Superb dimensional stability. Applications include EMI/RFI shielding and static dissipation.

Rapid room temperature curing silver filled electrically conductive adhesive. One to one mix ratio by weight or volume. Fixture time within 5-7 minutes even in small volumes. Exceptional low volume resistivity. Low outgassing. Superior bond strength to similar/dissimilar substrates/ Serviceable from -60°F to +250°F.

Cost effective alternative to silver filled epoxy with a silver coated nickel filler. Excellent conductivity and physical properties. Superior durability and thermal cycling capabilities. Cures readily at room temperature. Convenient one to one mix ratio weight or volume. Superb heat dissipation. Low linear shrinkage upon cure. Withstands 1,000 hours 85°C/85% RH. Serviceable from 4k to +275°F. Available in premixed and frozen syringes.

Low viscosity, optically clear adhesive. Resistant to thermal cycling and thermal shock. Highly desirable Shore D hardness range. Bonds well to dissimilar substrates. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.