Expanded Product List
Master Bond Product Search
552 products match
 |
EP90FR-HFL Toughened epoxy system complies with FAR standard 14CFR 25.853(a) for flame retardancy. Bonding, sealing, coating, potting compound. Passes horizontal burn test specification. Withstands mechanical shock and vibration. Thermal cycling resistant. Non-halogenated type system. Bonds well to dissimilar substrates. Serviceable from -60°F to +250°F. Impressive electircal insulator. |
 |
EP90FR-V Two part epoxy passes vertical burn test portion of FAR standard 14 CFR 25.853(a) for flame retardancy. Passes Boeing standard BSS 7238, Revision C for low smoke and BSS 7239, Revision A for toxicity. Bonds well to variety of substrates. One to one mix ratio by weight. Moderate viscosity. Serviceable from -60°F to +250°F. Excellent electrical insulator. Non-halogenated system. |
 |
EP93AOFR Two component high strength flame retardant epoxy system that meets stringent horizontal burn test portion of the FAR standard 14 CFR 25.853(a). Non-halogenated system serviceable from -80°F to +300°F. Forgiving one to one mix ratio by weight. Good electrical insulation. |
 |
EP93FRHT Two part epoxy system that passes Airbus specifications for flame resistance, smoke density and toxicity. Bonds well to a variety of substrates including metals, composites, glass, ceramic and many plastics. One to one mix ratio by weight. Moderate viscosity. Service operating temperature range from -80°F to +400°F. Excellent electrical insulator. Non-halogenated system. |
 |
FL901AO High performance, thermally conductive, electrically insulative, resin based epoxy adhesive film system. Offers superior mechanical strength, convenient handling, good storage stability and fast cures at moderate temperatures. Uniform bond line thickness. Special preforms can also be prepared in multiple shapes and sizes. Serviceable from -100°F to +400°F. |
 |
FLM36 B-staged film adhesive/sealant. Outstanding thermal cycling capabilities and structural properties. Offers superior toughness and flexibility. Excellent strength retention at elevated temperatures. Thermally conductive/electrically insulative. Provides uniform bond line thickness. Serviceable from -100°F to +500°F. Preforms are available. |
 |
FLM36-LO NASA low outgassing approved B-stage epoxy adhesive. Tough and flexible. Elongation is greater than 50%. Thermally conductive/electrically insulative. Withstands rigorous thermal cycling. Can be die cut into custom shapes. Squeeze out is minimal. Ideal for applications requiring precise bond lines. Resists up to +500°F. |
 |
LED401 One part, no mix, fast curing compound. Tack free cure. High bond strength to a wide range of substrates. Solvent free formulation. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. |
 |
LED401 White High viscosity, one component system in white. Excellent dimensional stability, electrical insulation properties and good chemical resistance upon cure. Serviceable from -60°F to +250°F. |
 |
LED401LV One part, low viscosity, optically clear system. Fast curing with a high bond strength. Superior dimensional stability and electrical insulative properties. Serviceable from -60°F to +250°F. |