Expanded Product List
Master Bond Product Search
619 products match
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EP3FL Flexibilized one part epoxy system. Withstands severe environmental conditions in service. 100% reactive. Brown/yellow color. Resists thermal and mechanical stresses. Low shrinkage. Serviceable from -100°F to +250°F. |
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EP3HT Fast, one component heat curable adhesive. Serviceable from -60°F to +400°F. High shear strength properties. Shore D hardnes >70. "Unlimited" working life at room temperature. Superb electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
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EP3HT-LO Rapid curing, one part epoxy. Meets NASA low outgassing standards. Moderate viscosity. High shear strength. Serviceable from -60°F to +400°F. Withstands 1,000 hours 85°C/85% RH. |
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EP3HTFL Heat resistant, flexibilized one component epoxy resin system. Superior physical strength properties. Inert to water and chemicals. Provides protection against rigorous thermal cycling and mechanical stress. Serviceable from -60°C to +175°C. |
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EP3HTMed Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |
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EP3HTN Nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTND-2Med Black Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Non-drip, paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |
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EP3HTS Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTS-LO High performance, one component silver filled electrically conductive adhesive. Low volume resistivity. Bonds wells to a wide range of substrates. Meets NASA low outgassing requirements. Thermally conductive. Rapid cures at moderate temperatures. Easy to dispense. Serviceable from -60°F to +400°F. |
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EP3HTS-TC Silver filled electrically conductive, for die attach and general bonding. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Thixotropic paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |