Expanded Product List
Master Bond Product Search
619 products match
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EP38CL Two component, low viscosity, optically clear epoxy adhesive, coating, sealant, encapsulant. Superior toughness and durability. Possesses extraordinary impact resistance. Protects against thermal cycling. Withstands 1,000 hours 85°C/85% RH. Service temperature range is -100°F to +250°F. |
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EP38FLAO Highly flexible. Thermally conductive/electrically insulative. Excellent flowability. Well suited for potting and encapsulation. Withstands rigorous thermal cycling and shocks. Low exotherm. Long working life. One to one mix ratio by weight or volume. Serviceable from -100°F to +250°F. |
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EP39-2 Low viscosity, two component epoxy system. Superior light transmission properties. Rigid curing. Short tack-free time. Can be applied by roller, brush or conventional spraying equipment. Superior chemical resistance. Serviceable from -60°F to +300°F. Successfully tested for 1,000 hours 85°C/85% RH. Guards against wear. |
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EP39-2LV Fast curing, chemical resistant epoxy system. Convenient two to one mix ratio by weight. Superior protection against wear. 100% reactive. Optically clear. Easy application by brush, roller, spray equipment. Cures rigid. Ideal for polishing. Service temperature range -60°F to +300°F. |
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EP39-M Two part epoxy adhesive/sealant featuring excellent electrical insulation properties. Thermal stability. Superior chemical resistance. Guards against thermal cycling. Adheres well to similar/dissimilar substrates. Low viscosity. Serviceable from -60°F to +350°F. |
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EP39MAOHT Thermally conductive, low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Service temperature range -100°F to +400°F. |
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EP39MHT Low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Successfully tested for 1,000 hours 85°C/85% RH. Service temperature range -100°F to +400°F. |
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EP3ANHT Heat resistant thermal conductive epoxy for potting and bonding. No mix system. 100% reactive. Thermal conductivity 23 BTU in/ft2/hr/°F. Gel time 90-100 seconds at 150°C. Volume resistivit <1015 ohm-cm. Offers protection against abrasion and thermal cycling. Serviceable from -60°F to +400°F. |
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EP3AOHT Light paste. One component, no mix system. Thermally conductive/electrically insulative. Service temperature range -60°F to +400°F. Flexible cure schedules. Cost effective. |
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EP3AOHTLV Single component thermally conductive/electrically insulative epoxy for bonding/potting. Heat resistant. Fast curing. Offers excellent adhesion to metallic and nonmetallic substrates. Serviceable from -60°F to +400°F. |