Expanded Product List
Master Bond Product Search
139 products match
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EP30-3 Heat curable, optically clear epoxy. Serviceable from -80°F to 450°F. Excellent dimensional stability. T >325°F. Shore D hardnes >75. Outstanding dielectric strength. First rate chemical resistance. Low viscosity. Long working life. Easy to apply. |
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EP30-3LO Superb optical clarity. Serviceable from -80°F to +450°F. T >175°C. Low viscosity and long working life. Superior dielectric properties. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. |
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EP30-4 Rapid room temperature curing two component epoxy system. Low viscosity. Optically clear and non-yellowing. Superior chemical resistance. Superb electrical insulation properties. Cures quickly even in thin sections. High bond strength. Two to one mix ratio by weight. Low shrinkage. Shore D hardnes >80. Serviceable from -60°F to +250°F. |
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EP30-4Med Rapid room temperature curing two component epoxy system. Low viscosity. Optically clear and non-yellowing. Superior chemical resistance. Superb electrical insulation properties. Cures quickly even in thin sections. High bond strength. Two to one mix ratio by weight. Low shrinkage. Shore D hardnes >80. Serviceable from -60°F to +250°F. |
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EP30D-10 Optically clear, elastomeric system. Urethane modified epoxy. 100% reactive. Serviceable from -100°F to 220°F. Long working life. Resistant to thermal cycling. High impact strength. Outstanding flexibility. Protects against abrasion. Minimal linear shrinkage upon cure. Low moisture permeability. |
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EP30F |
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EP30HT High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values. |
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EP30HT-LO Thermally stable, room temperature curing epoxy. Features high optical clarity and superior physical strength properties. Passes ASTM E595 tests for NASA low outgassing. Electrically insulative. Dimensional stable, rigid bonds. Low shrinkage upon cure. Well suited for smaller potting and encapsulation applications. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +300°F. |
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EP30HV High performance epoxy adhesive, sealant and coating. Superior physical strength properties. Bonds well to similar and dissimilar substrates. Conforms to FDA Chapter 1, Section 175.105 specification for indirect food contact. Solvent free system. Optically clear. Rigid bonds. Outstanding chemical resistance. Room temperature curing. Serviceable from -60°F to +300°F. |
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EP30LP-2 Low viscosity epoxy resin system. Superb optical clarity and light transmission properties. High strength rigid bonds. Service operating temperature range from -60°F to +250°F. Ideal for potting and encapsulation. Excellent dielectric characteristics. Low shrinkage. |