619 products match
EP30LTE Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates. |
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EP30LTE-2 Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates. |
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EP30LTE-4 Extra low thermal expansion coefficient and unmatched dimensional stability. Used for bonding, sealing, coating, casting. Service operating temperature range from -60°F to +250°F. Mixed viscosity 15,000-20,000 cps. Ambient temperature curing. |
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EP30LTE-LO Black Two component epoxy system. Low thermal expansion coefficient and dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30LTE-LO Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30LV High performance general purpose adhesive, sealant, casting compound. Low viscosity. Optically clear. High bonding strength. Electrically insulative. Easy to apply. Allows for wicking and capillary action. Room temperature curing. Serviceable from -60°F to +250°F. |
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EP30LV-1 Ultra low viscosity epoxy system. Cures at room temperature. Outstanding optical clarity. Electrically insulative. High strength rigid bonds. Fills gaps in confined areas. Serviceable from -60°F to +250°F. |
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EP30M3LV-2NV Epoxy-urethane blend. Superior toughness and abrasion resistance. Biocompatible. Cryogenically serviceable. Low viscosity. Low moisture absorption and hydrolytic stability. USP Class VI approved. Serviceable from 4k to +250°F. Outstanding electrical insulation properties. Withstands thermal cycling. High impact strength. |
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EP30M3LV-NV Low viscosity epoxy potting/casting compound. Superior electrical insulation properties. Long open time. Low exotherm. Contains special air release agents to prevent bubble formation. Shore D hardness 55-70. Excellent chemical resistance. Serviceable from -60°F to +250°F. |
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EP30M3LVR Potting/casting compound. Cures at ambient temperature. Good flowability. Special additives enhance release of air bubbles. 100% reactive. Superior electrical insulation properties. High physical strength. Chemical resistant. Serviceable from -60°F to +250°F. |