Expanded Product List
Master Bond Product Search
619 products match
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EP21TDCS Two component, silver filled electrically conductive epoxy system with a convenient one to one mix ratio and very low volume resistivity. Cures at room temperature. Superior toughness. Serviceable from 4K to +275°F. Withstands rigorous thermal cycling. Successfully tested for 1,000 hours 85°C/85% RH. Exhibits superb thermal conductivity. |
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EP21TDCS-LO Silver conductive, room temperature curing epoxy adhesive meets NASA low outgassing specifications. Serviceable from 4K to +275°F. High bond strength properties. Withstands thermal cycling. Outstanding toughness. Volume resistivit <10-3 ohm-cm. Paste viscosity. Convenient one to one mix ratio by weight or volume. |
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EP21TDCSFL SIlver filled electrically conductive epoxy adhesive. Low volume resistivity. Highly flexible. Excellent peel and shear strength. Low linear shrinkage upon cure. Good flow properties. Cures at room temperature. Resists vibration, impact, thermal cycling. Serviceable from 4K to +250°F. |
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EP21TDCSMed Silver conductive epoxy with low volume resistivity and USP Class VI certification. Cures at room temperature or more quickly at elevated temperatures. Durable. Serviceable from 4k to +250°F. Smooth paste. One to one mix ratio by weight or volume. Shore D hardness 50-60. High bond strength. |
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EP21TP-2NV Two component polysulfide/epoxy adhesive/sealant. Cures at room or elevated temperature. Exceptional toughness and chemical resistance properties. Withstands exposure to fuels, oils, hydrocarbons and hydraulic fluids. Forgiving one to one mix ratio. Excellent electrical insulation properties. Serviceable from -80°F to +250°F. |
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EP21TPFL-1 Low viscosity two component epoxy polysulfide system. Excellent resistance to water, gasoline, fuels, oils, hydrocarbons and hydraulic fluids. Outstanding flexibility. Formulated to cure at ambient temperatures. Serviceable from -60°F to +250°F. |
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EP21TPFL-1AO Two part, room temperature curing, very flexible polysulfide system with excellent thermal conductivity. Low viscosity and good flowability for potting and encapsulating applications. Superior electrical insulation characteristics. Withstands thermal cycling. Reliable resistance to fuels and oils. Long open time. Serviceable from -60°F to +250°F. |
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EP21TPHT Two component polysulfide/epoxy adhesive/sealant. Cures at room or elevated temperature. Exceptional toughness and chemical resistance properties. Withstands exposure to fuels, oils, hydrocarbons and hydraulic fluids. One to one mix ratio by weight or vollume. Excellent electrical insulation properties. Serviceable from -80°F to +350°F. |
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EP21TPHTAO Two component thermally conductive/electrically insulative polysulfide epoxy adhesive/sealant. Durable tough high strength bonds. Unsurpassed resistance to fuels and oils. Serviceable from -60°F to +325°F. |
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EP21TPLV-NV Two part, room temperature curing epoxy polysulfide system with excellent flow. Used primarily for potting, encapsulating and coating applications. One to one mix ratio by weight or volume. Resists exposure to water, gasoline, fuels, oils, hydrocarbons, hydraulic fluids. Outstanding durability and toughness. Service operating temperature range from -80°F to +250°F. |