Expanded Product List
Master Bond Product Search
355 products match
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EP21TDCF-3NV Rapid, room temperature curing, toughened epoxy adhesive. 100% reactive system. High peel and shear strength properites. Superior thermal cycling capabilities. Thixotropic paste. Gap filling. Chemically resistant. Non-critical one to one mix ratio by weight or volume. Resistant to vibration and shock.Serviceable from -410°F to +250°F. |
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EP21TDCF1 High peel/shear strength epoxy adhesive. Short fixture time. Fast room temperature cures. Excellent toughness. Superior thermal cycling capabilities. Adheres well to similar/dissimilar substrates. Thixotropic paste. Gray color. Serviceable from -100°F to +250°F. |
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EP21TDCHT High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties. |
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EP21TDCHT-1 Flexibilized two component epoxy adhesive. Cures at room temperature or more rapidly at elevated temperatures. Forgiving one to one mix ratio. Ideal for bonding substrates with CTE mismatches. Superior chemical resistance. Durable. Service operating temperature range from -100°F to +400°F. |
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EP21TDCHT-LO Two component, toughened epoxy adhesive. High peel strength and shock resistant. NASA low outgassing certified. Convenient one to one mix ratio. Ideal for bonding similar and dissimilar substrates. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +350°F. Good flow. Easy to apply. |
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EP21TDCHTND Epoxy paste adhesive. Non-drip system. Gap filling. Superior toughness. Withstands rigorous thermal cycling. Impressive bond strength. Serviceable from -100°F to +350°F. Convenient one to one mix ratio. Excellent electrical insulator. |
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EP21TDCN Nickel conductive epoxy adhesive. Volume resistivity is 5-10 ohm-cm. 100% reactive. Superior toughness. One to one mix ratio by weight or volume. Smooth paste viscosity. Ambient temperature cures or fast elevated temperature cures. Service operating temperature range from -100°F to +275°F. High bond strength. |
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EP21TDCN-LO Two component nickel conductive epoxy featuring high peel strength, superior toughness and low volume resistivity. Withstands thermal cycling. Meets NASA low outgassing specifications. The service temperature range is -100°F to +275°F. |
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EP21TDCNFL Two component nickel conductive epoxy adhesive. High flexibility. Excellent peel strength. Service temperature range from 4K to +250°F. Low shrinkage upon cure. Resists a wide range of chemicals. Volume resistivity 5-10 ohm-cm. Convenient one to one mix ratio by weight or volume. |
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EP21TDCS Two component, silver filled electrically conductive epoxy system with a convenient one to one mix ratio and very low volume resistivity. Cures at room temperature. Superior toughness. Serviceable from 4K to +275°F. Withstands rigorous thermal cycling. Successfully tested for 1,000 hours 85°C/85% RH. Exhibits superb thermal conductivity. |