Expanded Product List
Master Bond Product Search
355 products match
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EP22ND High performance aluminum filled epoxy with one to one mix ratio. Excellent bond strength to metal surfaces. Resists many chemicals and thermal cycling. Low shrinkage upon cure. Easy to apply. Flowable paste viscosity. Exceptionally high compressive strength. Superior dimensional stability. Easily machinable. Service operating temperature range from -60°F to +250°F. |
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EP24 Fast setting, room temperature curing, high bond strength epoxy adhesive. Easy to apply. Moderate viscosity. Convenient one to one mix ratio. Bonds well to similar/dissimilar substrates. Fine electrical insulation properties. Excellent dimensional stability. Service operating temperature range from -60°F to +250°F. |
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EP24AN Fast curing two component epoxy adhesive. Outstanding thermal conductivity and electrical insulation properties. Self leveling paste. Easy to apply. High bond strength. Long term durability. Low coefficient of expansion. Superb dimensional stability. Service operating temperature range from -60°F to +250°F. |
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EP24AO Thermally conductive/electrically insulative epoxy adhesive. Fast curing at ambient temperature. Non-critical equal weight or volume mix ratio. High bond strength. Dimensionally stable. Service operating temperature range from -60°F to +250°F. |
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EP28 Excellent flowability and unique wetting characteristics. Thermal and electrical insulator. Solvent free two part epoxy system. Cures quickly at room temperature. Exceptionally strong bonds. Serviceable from -60°F to +250°F. |
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EP29LP Clear, two component epoxy system has long pot life. Convenient one to one mix ratio. High bond strength. Superb chemical resistance properties. Used in bonding, sealing, potting and filament winding applications. Low viscosity compound. Exceptionally low exotherm. Cures rigid. Service operating temperature range from -60°F to +250°F. |
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EP29LP-1 Low viscosity room temperature curing epoxy features long working life and low exotherm. Contains no solvents. Optically clear. High physical strength properties. Versatile cure schedules. Ideal for filament winding and large volume potting. Superior chemical resistance to water, fuels, acids, bases and salts. Serviceable from -100°F to +250°F. |
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EP29LPAO Thermally conductive/electrically insulative epoxy for large potting/encapsulation applications. Low exotherm. Long working life. Excellent flow properties. Very low shrinkage upon cure. Impressive compressive strength. Shore D hardness 80-90. Serviceable from -60°F to +250°F. |
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EP29LPAOHT Two component epoxy system featuring good thermal conductivity along with being electrically isolating. It is a low to moderate viscosity system with excellent flow properties. It can be mixed in masses over a gallon because it generates an exceptionally low exotherm. High modulus, outstanding compressive strength, and a low coefficient of thermal expansion. The service temperature range is -60°F to +350°F. |
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EP29LPHE Low viscosity epoxy for large potting/encapsulation applications. Low modulus, high elongation. Long working life. Exceptionally low shrinkage upon cure. Impressive optical clarity. Low exotherm. Serviceable from -60°F to +250°F. |