Military equipment can be exposed to extreme environmental stress throughout its service life. Meeting these specifications can be daunting. Compounds are used in the assembly of aircraft, ships, vehicles and electronic systems where protection against random vibration/shock, fluid immersion, high/low temperatures and acoustic noise is essential. From sand/dust exposure to rain, humidity, fungus to low pressure, acceleration, products have to preform when needed.
Master Bond works directly with defense equipment manufacturing company engineers in providing solutions for their specific application needs. Our line of ruggedized adhesives, sealants, coatings, potting/encapsulation compounds feature high reliability in extreme climactic conditions. We provide one on one technical support and have decades of experience in solving problems. Often, existing formulations are adjusted to meet unusual performance and processing requirements.
Special grades of one and two component epoxy liquid/paste, film/preform systems have been tailor made to meet difficult qualification standard test results. These include:
- Cryogenic serviceability
- NASA low outgassing approval
- Thermal shock resistance
- Halogen free systems
- High Tg
Our broad line of products have achieved widespread acceptance in the design/fabrication of sensing/imaging, communication/tracking, interception, command/control, countermeasures, satellite navigation, laser guidance systems. Leading defense contractors/subcontractors effectively employ Master Bond conductive/non-conductive polymeric adhesives for joining similar/dissimilar substrates including ceramic, plastics, rubber, metal, composites to eliminate hole drilling/mechanical fasteners, shorten cycle times and lower weight in the assembly of critical components.
Ready to use, easy to handle epoxy films/preforms are available in various thicknesses and feature fast cures, bond line uniformity, minimal squeeze out, little waste, good storage stability. Some of these materials will not sag/slump during cure and exhibit outstanding bond strength, fracture toughness, protections against moisture/corrosion. Two component liquid/paste epoxy structural adhesives cure at ambient/elevated temperatures, have good wetting properties, shock absorption, fill gaps/voids, resist cyclic fatigue/chemical exposure and offer high impact/shear strength. Oven/autoclave curing one part epoxy systems polymerize at low temperatures and are frequently used in high volume production applications. Some of the fast setting, non-corrosive no mix silicone adhesives meet MIL-A-46146 and MIL-A-46146A type 1 specifications. They can accommodate differences in CTE's and are easily automatable.
New adhesive formulations containing nanofillers have been developed to meet the challenging, evolving needs of the defense industry. This has led to novel products with improved hardness, toughness, electrical/thermal conductivity, dimensional stability, strength, chemical/temperature resistance depending on the type, shape/structure, aggregation state of the nanoparticles. These performance enhancements have helped enable defense equipment manufacturing companies to deliver cutting edge, technologically advanced products.