EP28 Product Description

Master Bond EP28 is a clear, low viscosity two-component epoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most metals and nonmetallics including ceramics, glass and many plastics. It features excellent flowability and unique wetting characteristics and can be easily applied to most surfaces after mixing the two components in a noncritical, convenient mix ratio of 1:1, weight or volume. Master Bond EP28 is especially recommended for assembly and repair of high performance electronic and aerospace systems and those most demanding industrial applications where an initial low viscosity and nearly transparent bondline appearance are needed. Fully cured Master Bond EP28 is an excellent thermal and electrical insulator and has superior chemical resistance to water. most aqueous solutions and many other chemicals including gasoline, petroleum solvents, jet fuels etc.