Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to +250ºF.
Flexibility is of vital importance in the design of medical devices subjected to vibration, impact, shock and thermal cycling. Two component, room temperature curing Master Bond MasterSil 151Med is a medical grade, potting and encapsulation silicone formulated to withstand such exposures.
Master Bond UV10TK40 is a UV curable, no-mix epoxy resin system with exceptional sealing and gap-filling properties. It excels in applications such as aligning parts and bonding irregularly shaped surfaces, especially in production environments where increased speed and reduced waste are paramount.
Developed after years of research, Master Bond EP46HT-1 extends the limits of epoxy adhesive/sealant formulations. It has a continuous service operating temperature range of -100°F to +600°F and can withstand intermittent exposures up to +600°F. EP46HT-1 has a glass transition temperature of over 240°C.
Master Bond Inc., Hackensack, NJ has developed a new, easy to use, two component epoxy adhesive for high performance bonding applications called EP30. It develops outstanding physical strength properties even when cured at ambient temperatures. Cure can be accelerated by use of moderate heat.
Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various cross section thicknesses.