Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas.
It has an advantageously long working life of 2-4 hours at 75°F for a 100 gram mass.
Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio by weight or volume.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.
It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required.
Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1.
It is serviceable from -60°F to +450°F (-51°C to +232°C). Most noteworthy, Supreme 62-1 provides chemical resistance to a wide range of acids, bases, fuels and solvents even at elevated temperatures.
Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications.
As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature.
This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)].
Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures.
It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound.
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps.
Its ultra low viscosity makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or encapsulation.