Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/(m•K)] and superior electrical insulation properties. Volume resistivity i >1014 ohm-cm.
Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)].
Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz.
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer.
Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. “This specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics.