Master Bond Inc. of Hackensack, New Jersey has introduced a new high performance, room temperature curing, two component epoxy adhesive/sealant called EP34AN. This compound features a thermal conductivity of 22-24 BTU/in/ft²/hr/°F. Physical properties are maintained even after long exposure to temperatures in the 400-450°F range.
Master Bond Inc. of Hackensack, New Jersey has introduced a new room temperature curing, two component epoxy adhesive, sealant, coating and casting material called EP42HT-2. This compound features high temperature resistance along with outstanding chemical resistance.
Master Bond Inc. of Hackensack, New Jersey has developed EP24, new fast curing, two component epoxy adhesive. This high performance system cures at room temperature or more rapidly at elevated temperatures. Additionally, it will cure at colder temperatures, down to 20°F. It is easy to use and has a convenient non critical mix ratio of 1 to 1 by weight or volume.