Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.
Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.
Master Bond is pleased to announce the release of EP42HT-2FG, a new food grade epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials.
Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries.
Optically Clear, Highly Flexible Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions
For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF. This optically clear, two component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling.
For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component epoxy can withstand harsh, acidic environments, including prolonged immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over a year.