Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices.
This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity.
Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications.
It is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing.
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown.
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.
It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C.
With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for
Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications
where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)],
Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity
and therefore can be utilized in many medical device applications. It features high temperature resistance,
good flow properties and is suitable for bonding, sealing and coating.