Engineered with a silicon carbide filler material, Master Bond EP21SC-1 delivers abrasion resistance for an array of chemical and mechanical processing applications. This epoxy has a smooth paste consistency and a non-critical one to one mix ratio by weight or volume. As a two part system, it cures readily at room temperature or more quickly at elevated temperatures.
Placing an emphasis on convenient handling, Master Bond MasterSil 705TC features a paste consistency that doesn’t require mixing. This single component system sets up in 7 minutes and has a non-corrosive cure at room temperature when exposed to atmospheric humidity.
Primarily used for potting and encapsulation applications, Master Bond Super Gel 9AO is a soft, urethane modified gel-like epoxy that offers thermal conductivity and electrical insulation properties. This two part system is also employed for bonding and sealing as it adheres well to a variety of substrates including metals, glass, ceramics and many rubbers and plastics.
Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.
Formulated with a silver coated nickel filler, Master Bond EP79FL is a two part, electrically conductive epoxy for bonding, sealing and coating applications. It has low volume resistivity of less than 0.005 ohm-cm and is suitable for a variety of uses in the electronic, aerospace, computer, semiconductor and electro-optic industries.
Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.