Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures.
With enhanced chemical resistance Master Bond MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating applications in aerospace, electronics, specialty OEM and other industries. This one part system is able to withstand exposure to water, fuels, oils, greases, refrigerants, acids, bases and solvents better than standard silicones.
Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber. This non-drip compound is formulated for a variety of bonding, sealing and coating applications in the optical, opto-electronic, electrical, aerospace and specialty OEM industries.
Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond EP3RR-80 is a one component epoxy that offers user friendly handling. It has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing.
Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight.
Formulated primarily for high performance structural bonding applications, Master Bond EP13SPND-2 is a one part, high temperature resistant epoxy for the aerospace and specialty OEM industries. As a single component system, this product is easy to handle and does not require mixing prior to use. It also has an unlimited working life at room temperature.