Two Component, Flexible, Moderate Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding And Sealing. High strength structural bonding. NASA low outgassing.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +350°F Featuring High Peel and High Shear Strength
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +250°F Featuring High Peel and High Shear Strength
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.
