Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F.
Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Bonding, Potting, Sealing & Coating. Offers High Temperature Resistance & Excellent Thermal Properties along with Good Flow.
Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Conforms to FDA Section 175.105 for Indirect Food Applications.
Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Lower Viscosity Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
