One component, toughened, electrically insulating epoxy for die attach applications
Toughened, two component epoxy system featuring high temperature resistance and NASA low outgassing
One component, heat curing epoxy for structural bonding applications
One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications
B-staged film for high performance bonding and sealing, NASA low outgassing approved
One component, electrically conductive sodium silicate, aqueous based coating system
One component, thermally conductive epoxy adhesive
Two part, thermally conductive, electrically insulative epoxy for bonding and sealing featuring outstanding heat resistance; requires oven curing
One component epoxy system for impregnation, sealing and coating
Two component, condensation curing silicone for potting, encapsulation and sealing
