Two Component, Flexibilized, Highly Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.
Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.
Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity.
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.
High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications
Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.
Two Component, Thermally Conductive, Electrically Insulative, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock.
