Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications
Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.
Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Potting Featuring Excellent Physical Strength Properties and Optical Clarity. Meets FDA Chapter 1, Section 175.105 for Indirect Food Applications.
