Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
One Component, Heat Curing Structural Adhesive Featuring High Tensile Shear Strength and High Temperature Resistance for Optimal Bonding Performance Up To 450°F.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.
One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties. Meets USP Class VI Specifications.
