Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.
Two Component Thermally Conductive, Electrically Insulative Epoxy Adhesive Flexibilized For High Performance Bonding Featuring Exceptionally High Thermal Conductive
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications
