Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength
Two Component, Black Colored, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
UL94HB flame retardant, two component epoxy system. For encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickess with a PLC of 0. Convenient processing, 1:1 mix ratio by weight.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..
